Toshiba announces delay in sealing deal on chip unit sale

Toshiba announces delay in sealing deal on chip unit sale

Shareholders of Toshiba Corp. gather for their general meeting at Makuhari Messe convention center near Tokyo on June 28, 2017. Prior to the meeting, the company announced in a statement a delay in closing a deal with a Japan-U.S.-South Korean consortium on the sale of its chip unit. (Kyodo) ==Kyodo

  • Product Code
  • ILEA000111360
  • Registered date
  • 2017/6/28 10:28:25
  • Credit
  • Kyodo / Kyodo News Images
  • Media source
  • 2017 Kyodo News
  • Media size
  • 3968 × 2660 pixel
  • Resolution
  • 240 dpi
  • Deployment size
  • 554.10(KB)*
  • Special instruction

*File size when opened in Photoshop, etc.

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