2023 World Artificial Intelligence Conference in Shanghai

SHANGHAI, CHINA - JULY 6, 2023 - liepin unveils a 3D digital interviewer that can conduct AI interviews at the 2023 World Artificial Intelligence Conference in Shanghai, China, July 6, 2023.

• Product Code
• ILEA001513812

• Registered date
• 2023/7/06 00:00:00

• Credit
• CFOTO / Kyodo News Images

• Media source
• CFOTO

• Media size
• 4860 × 2972 pixel

• Resolution
• 72 dpi

• Deployment size
• 3.86(MB)*

• Special instruction
• China Out
  **The text may be generated by an automatic translation system**

*File size when opened in Photoshop, etc.