2023 World Semiconductor Congress in Nanjing

Visitors visit the encapsulated wafer chip displayed by NANTONG FUJITSU MICRO ELECTRONICSCO at the World Semiconductor Congress 2023 in Nanjing, Jiangsu province, China, July 19, 2023. (Photo by Costfoto/NurPhoto)

• Product Code
• ILEA001540997

• Registered date
• 2023/7/19 00:00:00

• Credit
• NurPhoto / Kyodo News Images

• Media source
• Costfoto/NurPhoto

• Media size
• 5520 × 3680 pixel

• Resolution
• 300 dpi

• Deployment size
• 2.09(MB)*

• Special instruction
• NO USE CHINA
  

*File size when opened in Photoshop, etc.