MWC 2024 In Shanghai
Huada Semiconductor booth is being seen at SNIEC in Shanghai, China, on June 26, 2024, during the opening of Mobile World Congress (MWC) 2024. (Photo by Ying Tang/NurPhoto)
- Product Code
- ILEA002923400
- Registered date
- 2024/6/26 00:00:00
- Credit
- NurPhoto / Kyodo News Images
- Media source
- Ying Tang/NurPhoto
- Media size
- 6000 × 4000 pixel
- Deployment size
- 14.56(MB)*
*File size when opened in Photoshop, etc.