Chinese Chip Industry Subsidies
SHANGHAI, CHINA - JUNE 26, 2024 - Visitors visit Huawei's stand at the Mobile World Congress 2024 in Shanghai, China, June 26, 2024.
- Product Code
- ILEA003166055
- Registered date
- 2024/6/26 00:00:00
- Credit
- CFOTO / Kyodo News Images
- Media size
- 5536 × 3729 pixel
- Deployment size
- 3.65(MB)*
- Special instruction
-
No Use China
**The text may be generated by an automatic translation system**
*File size when opened in Photoshop, etc.