Chinese Chip Industry Subsidies

SHANGHAI, CHINA - JUNE 26, 2024 - Visitors visit Huawei's stand at the Mobile World Congress 2024 in Shanghai, China, June 26, 2024.

• Product Code
• ILEA003166056

• Registered date
• 2024/6/26 00:00:00

• Credit
• CFOTO / Kyodo News Images

• Media source
• CFOTO

• Media size
• 5363 × 3594 pixel

• Resolution
• 300 dpi

• Deployment size
• 2.64(MB)*

• Special instruction
• No Use China
  **The text may be generated by an automatic translation system**

*File size when opened in Photoshop, etc.