Hong Kong-Shenzhen Innovation And Technology Park Buildings 8 And 9 Topping-out Ceremony

Hong Kong-Shenzhen Innovation And Technology Park Buildings 8 And 9 Topping-out Ceremony

Hong Kong Chief Executive John Lee and other guests are on stage during the Hong Kong-Shenzhen Innovation and Technology Park Buildings 8 and 9 Topping-out Ceremony in Hong Kong, on March 21, 2025. (Photo by Vernon Yuen/NurPhoto)

  • Product Code
  • ILEA004196924
  • Registered date
  • 2025/3/21 00:00:00
  • Credit
  • NurPhoto / Kyodo News Images
  • Media source
  • Vernon Yuen/NurPhoto
  • Media size
  • 6048 × 4032 pixel
  • Resolution
  • 300 dpi
  • Deployment size
  • 16.79(MB)*
  • Special instruction

*File size when opened in Photoshop, etc.

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