3rd CISCE Held in Beijing
BEIJING, CHINA - JULY 17, 2025 - A visitor experienced an immersive interactive game enabled by the Snapdragon XR2 platform at the Qualcomm booth at the 3rd China International Supply Chain Expo in Beijing, China on July 17, 2025.
- Product Code
- ILEA004593672
- Registered date
- 2025/7/17 00:00:00
- Credit
- CFOTO / Kyodo News Images
- Media size
- 3500 × 2333 pixel
- Deployment size
- 1.50(MB)*
- Special instruction
-
CHINA OUT
**The text may be generated by an automatic translation system**
*File size when opened in Photoshop, etc.