TI to build functional parts on 1 chip for cell phones

TI to build functional parts on 1 chip for cell phones

TOKYO, Japan - Texas Instruments Inc. Chairman and Chief Executive Officer Thomas Engibous gives a news conference in Tokyo onJuly 29. He announced a plan to squeeze all functional parts for mobile phones on to one chip in the near future. (Kyodo)

  • Product Code
  • ILEA000020424
  • Registered date
  • 2003/7/29 00:00:00
  • Credit
  • Kyodo / Kyodo News Images
  • Media source
  • Media size
  • 1209 × 1602 pixel
  • Resolution
  • 72 dpi
  • Deployment size
  • 218.85(KB)*
  • Special instruction

*File size when opened in Photoshop, etc.

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