2023 World Semiconductor Congress in Nanjing

Visitors visit the encapsulated wafer chip displayed by NANTONG FUJITSU MICRO ELECTRONICSCO at the World Semiconductor Congress 2023 in Nanjing, Jiangsu province, China, July 19, 2023. (Photo by Costfoto/NurPhoto)

Sample
PDF Preview

Product Code
ILEA001540984

Registered date
2023/7/19 00:00:00

Credit
NurPhoto / Kyodo News Images

Media source
Costfoto/NurPhoto

Media size
5520 × 3680 pixel

Resolution
300 dpi

Deployment size
2.09(MB)*

Special instruction
NO USE CHINA

*File size when opened in Photoshop, etc.

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