Groundbreaking ceremony for chip factory in Hokkaido

Groundbreaking ceremony for chip factory in Hokkaido

Atsuyoshi Koike, president of semiconductor venture Rapidus Corp., breaks ground during a ceremony in Chitose in Hokkaido, northern Japan, on Sept. 1, 2023. The Japanese government-subsidized chip venture was set up by Toyota Motor Corp. and seven other Japanese companies in 2022.

  • Product Code
  • ILEA001663070
  • Registered date
  • 2023/9/01 00:00:00
  • Credit
  • Kyodo / Kyodo News Images
  • Media source
  • 2023 Kyodo News
  • Media size
  • 3938 × 2806 pixel
  • Resolution
  • 240 dpi
  • Deployment size
  • 1.58(MB)*
  • Special instruction

*File size when opened in Photoshop, etc.

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