Chip factory construction site in Hokkaido

Chip factory construction site in Hokkaido

Photo taken from a Kyodo News helicopter on May 1, 2024, shows the construction site for a semiconductor factory in Chitose, Hokkaido, northern Japan, to be operated by Rapidus Corp., a Japanese government-subsidized chip venture set up by Toyota Motor Corp. and seven other Japanese companies in 2022.

  • Product Code
  • ILEA002637421
  • Registered date
  • 2024/5/01 00:00:00
  • Credit
  • Kyodo / Kyodo News Images
  • Media source
  • 2024 Kyodo News
  • Media size
  • 2674 × 1778 pixel
  • Resolution
  • 240 dpi
  • Deployment size
  • 2.06(MB)*
  • Special instruction

*File size when opened in Photoshop, etc.

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    Photo taken on Oct. 3, 2024, shows a space earmarked for a research and development center of chipmaker Rapidus Corp. inside printer manufacturer Seiko Epson Corp.'s plant in Chitose, Hokkaido, northern Japan. A ceremony marking the start of construction was held the same day, with the research center expected to begin operating in April 2026.
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      Rapidus R&D hub in northern Japan

      Yasunori Ogawa (L), president of printer manufacturer Seiko Epson Corp., and Atsuyoshi Koike, his counterpart of chipmaker Rapidus Corp., pose for a photo during a press conference in Chitose, Hokkaido, northern Japan, on Oct. 3, 2024. The two companies have agreed to the building of a Rapidus research and development center in Seiko Epson's plant in Chitose, with the facility expected to begin operating in April 2026.
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        Photo taken on Oct. 3, 2024, shows printer manufacturer Seiko Epson Corp.'s plant in Chitose, Hokkaido, northern Japan, in which a research and development center of chipmaker Rapidus Corp. will be housed. A ceremony marking the start of construction was held the same day, with the research center expected to begin operating in April 2026.
          CORRECTED: CORRECTED: PM Kishida at chip factory construction site in Hokkaido

          CORRECTED: CORRECTED: PM Kishida at chip factory construction site in Hokkaido

          Japan's Prime Minister Fumio Kishida speaks to the press on July 24, 2024, at the construction site of a semiconductor factory in Chitose, Hokkaido, northern Japan, to be operated by Rapidus Corp., the government-subsidized chip venture set up by Toyota Motor Corp. and seven other Japanese companies in 2022. (Pool photo)
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            CORRECTED: PM Kishida at chip factory construction site in Hokkaido

            Japan's Prime Minister Fumio Kishida (2nd from R) is pictured with Rapidus Corp. Chairman Tetsuro Higashi on July 24, 2024, as he visits the construction site of a semiconductor factory in Chitose, Hokkaido, northern Japan, to be operated by a government-subsidized chip venture set up by Toyota Motor Corp. and seven other Japanese companies in 2022. (Pool photo)
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                  Chip factory construction site in Hokkaido

                  Chip factory construction site in Hokkaido

                  Photo taken from a Kyodo News helicopter on May 1, 2024, shows the construction site for a semiconductor factory in Chitose, Hokkaido, northern Japan, to be operated by Rapidus Corp., a Japanese government-subsidized chip venture set up by Toyota Motor Corp. and seven other Japanese companies in 2022.
                    Chip factory construction site in Hokkaido

                    Chip factory construction site in Hokkaido

                    Photo taken from a Kyodo News helicopter on May 1, 2024, shows the construction site for a semiconductor factory in Chitose, Hokkaido, northern Japan, to be operated by Rapidus Corp., a Japanese government-subsidized chip venture set up by Toyota Motor Corp. and seven other Japanese companies in 2022.
                      Chip factory construction site in Hokkaido

                      Chip factory construction site in Hokkaido

                      Photo taken from a Kyodo News helicopter on May 1, 2024, shows the construction site for a semiconductor factory in Chitose, Hokkaido, northern Japan, to be operated by Rapidus Corp., a Japanese government-subsidized chip venture set up by Toyota Motor Corp. and seven other Japanese companies in 2022.