MWC Shanghai

SHANGHAI, CHINA - JUNE 26, 2024 - Exhibitors demonstrate the World's first solid-state active cooling chip at the 2024 Mobile World Congress (MWC Shanghai) in Shanghai, China, June 26, 2024.

• Product Code
• ILEA002922601

• Registered date
• 2024/6/26 00:00:00

• Credit
• CFOTO / Kyodo News Images

• Media source
• CFOTO

• Media size
• 4412 × 3008 pixel

• Resolution
• 350 dpi

• Deployment size
• 2.20(MB)*

• Special instruction
• No Use China
  **The text may be generated by an automatic translation system**

*File size when opened in Photoshop, etc.