Hygon Information AI Chip

Hygon Information AI Chip

The AI chip showcased by Hygon Information at the 2024 World Artificial Intelligence Conference held in Shanghai, Shanghai, China on July 4, 2024.

  • Product Code
  • ILEA004465590
  • Registered date
  • 2024/7/04 00:00:00
  • Credit
  • CFOTO / Kyodo News Images
  • Media source
  • CFoto
  • Media size
  • 5818 × 3893 pixel
  • Resolution
  • 350 dpi
  • Deployment size
  • 4.98(MB)*
  • Special instruction
  • CHINA OUT
    **The text may be generated by an automatic translation system**

*File size when opened in Photoshop, etc.

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