Sony unit, TSMC to invest 747 bil. yen in next-gen sensors

Sony unit, TSMC to invest 747 bil. yen in next-gen sensors

Photo taken on Aug. 11, 2026, shows a factory of Taiwan Semiconductor Manufacturing Co. in Hsinchu, Taiwan. Sony Group Corp.'s chip unit, Sony Semiconductor Solutions Corp., said the same day it will begin mass production of next-generation image sensors with TSMC in 2029, with the two companies investing a combined 747 billion yen ($4.7 billion).

  • Product Code
  • ILEA005090649
  • Registered date
  • 2026/8/11 00:00:00
  • Credit
  • Kyodo / Kyodo News Images
  • Media source
  • 2026 Kyodo News
  • Media size
  • 2700 × 1785 pixel
  • Resolution
  • 240 dpi
  • Deployment size
  • 944.10(KB)*
  • Special instruction

*File size when opened in Photoshop, etc.

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